Abstract: In the fields of optoelectronics and semiconductors, reliable fixation and handling of brittle materials (glass, wafer, etc.) in high-temperature, vacuum, and vibration environments face particular technical challenges. These challenges include the inability of suction cups in a vacuum, the residue of chemical adhesives, and the easy damage of mechanical clamping. In this paper, fluorine-based bionic adhesive pads (FBAPs) obtained using molding technology to imitate gecko micropillar arrays are presented. FBAPs inhibit the substantial decay of adhesive properties at high temperatures and provide stable and reliable performance in vacuum and vibration environments. The results demonstrated that the decayed force values of the normal and tangential strength of the FBAP were only 9.01% and 5.82% of the planar samples when warmed up to 300 °C from 25 °C, respectively. In a vacuum, all FBAPs exhibit less than 20% adhesion attenuation, and in a vibrational environment, they can withstand accelerations of at least 4.27 g. The design of the microstructure arrays enables the realization of efficient and non-destructive separation through mechanical rotation or blowing. It provides a bionic material basis for the fixation of brittle materials on smooth surfaces under complex environments and for transportation automation.

Key words: High-temperature environments')">High-temperature environments, van der Waals forces, Microstructure arrays, Fluoroelastomer, Interfacial manipulation